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filingDate 2003-04-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_396c22543adfc1fad24038c73bf995c7
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publicationDate 2003-11-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-03092911-A1
titleOfInvention Minimizing whisker growth in tin electrodeposits
abstract The present invention relates to a method for reducing tin whisker formation in tin deposits by plating on an underlying metal tin deposits which are essentially free of compressive stress or are predominantly in a predetermined crystal orientation that essentially matches that of the underlying metal in order to inhibit tin whisker growth. The deposits preferably exhibit no compressive stress or exhibit a tensile stress. Also, the most preferred crystal orientation is one that is the same as that of the underlying metal. The deposit preferably contains at least 95 % tin and optionally at least one alloying element of silver, bismuth, copper or zinc in an amount of 5 % or less. Advantageously, the tin deposits are provided during electroplating from a specially formulated plating solution that contains a crystal orientation surfactant.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4522970-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2007002424-A1
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2008082192-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010168666-A
priorityDate 2002-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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