| abstract |
THE PRESENT INVENTION PROVIDES A SEMIACQUEOUS CLEANING COMPOSITION FOR USE WITH ALUMINIUM, COPPER, AND LOW-K SUBSTRATES, THE CLEANING COMPOSITION COMPRISING BETWEEN ABOUT 1% TO ABOUT 30% OXALIC ACID DIHYDRATE, BETWEEN ABOUT 0.1% AND ABOUT 30% OF AN AMINE, AND WATER, WHEREIN THE CLEANING COMPOSITION CONTAINS LESS THAN ABOUT 0.5% FLUORINE-CONTAINING COMPOUNDS AND LESS THAN 0.5% PEROXIDES. |