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publicationNumber WO-03090792-A2
titleOfInvention Method and apparatus for treating a substrate with an ozone-solvent solution iii
abstract A general method and apparatus for treating materials at high speed comprises the steps of dissolving a relatively high concentration ozone gas in a solvent at a relatively low predetermined temperature T1 to form an ozone-solvent solution with a relatively high dissolved ozone concentration, and heating either the ozone-water solution or the material to be treated or both, the ozone-solvent solution and the material to be oxidized with a point-of-use heater to quickly increase the temperature to a predetermined higher temperature T2-T1, and applying the ozone-solvent solution to said material(s) whereby the heated ozone-water solution will have a much higher dissolved ozone concentration at said higher temperature, than could be achieved if the ozone gas was initially dissolved in water at said higher temperature. The liquid back-pressure regulator (158) is positioned downstream of drain outlet port (52) of materials processing module (50) and gas back-pressure regulator (180) is placed downstream of gas outlet port (62), either upstream of catalytic unit (64) or downstream of catalytic unit (64) as shown in this example.
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