| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_cf9de44937bdecf600d435ad30c716a2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c77315eed383b4db45154000be830a70 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-031 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-031
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 |
| filingDate |
2003-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d343332e62bc3382f5d7815508001ccc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d192f5729716041a70152a57ec33c920 |
| publicationDate |
2003-09-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-03073168-A1 |
| titleOfInvention |
Photosensitive resin composition, process for forming photosensitive elements or resist patterns with the same, and process for production of printed wiring boards |
| abstract |
A photosensitive resin composition comprising (A) a binder polymer, (B) a photopolymerizable compound bearing in the molecule at least one polymerizable ethylenically unsaturated bond, and (C) a photopolymerization initiator, characterized in that the component (B) consists of (B1) a photopolymerizable compound bearing at least two polymerizable ethylenically unsaturated bonds in the molecule and having a molecular weight of 800 to 3000 and (B2) a photopolymerizable compound bearing one polymerizable ethylenically unsaturated bond in the molecule and that (C1) a coumarin compound and (C2) a 2,4,5-triaryl- imidazole dimer are contained as at least part of the component (C) in a total amount of 80 wt% or above based on the whole weight of the component (C). |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005122123-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006106283-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4599974-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4485288-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-100434948-C
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104808440-A |
| priorityDate |
2002-02-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |