patent/WO-03063236-A1

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-03063236-A1

Outgoing Links

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filingDate	2002-10-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2aefbab6beb4245a8c3d2daa613fb960
publicationDate	2003-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	WO-03063236-A1
titleOfInvention	Semiconductor device with co-packaged die
abstract	A co-package semiconductor device (10) including an outer clip (12) in the form of a metal can includes also two semiconductor dies (30), at least one of which uses the outer clip as an electrical connector. An inner clip (28) is used to dispose one of the dies within the outer clip. The inner clip may be insulated from the outer clip by an insulating layer.
isCitedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8860198-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9054119-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2019287884-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10438877-B1
priorityDate	2002-01-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate	Subject
isCitedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-4314270-A
isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID418354341 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23978

Total number of triples: 67.