| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_eb6396d0ddd446e269382b79de263011
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9a429f09c9b5dd402351e3433aee8b8e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c0603794fbe7bd084617f31ff732691d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_294881271413951a95f284b588a68e66 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25F3-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7684
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25F3-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205 |
| filingDate |
2002-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_133d8f518a4b6bd37eb1e8c473426a6d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a4e07a27c60b7ec7b1e8afcfe90af398
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dc2e73daf99a24ef7923ec1ce4a2d431 |
| publicationDate |
2003-07-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-03058696-A1 |
| titleOfInvention |
Method of producing metal film |
| abstract |
A current concentration caused by an additive (especially, a brightener) remaining/depositing at a high density at a grain boundary triple-point and in a wiring groove portion in a copper-plating film surface layer is eliminated to restrict a lead elution and an abnormal elution, thereby obtaining the electropolished surface of a copper-plating film excellent in surface smoothness. A method of producing a metal film comprising the step of using a plating solution added with a plating additive for restricting void generation, bottom-up fill and over-fill to form a metal plating film (copper plating film (15)), and the step of using an electropolishing solution added with a polishing additive that reacts/bonds with a plating additive component contained in or deposited on a metal plating film surface layer to electropolish a metal plating film. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106463455-A |
| priorityDate |
2002-01-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |