| abstract |
A photosensitive resin composition comprising (A) a soluble polyimide which is prepared from a diamine having a siloxane structure or an aromatic ring structure and/or a diamine having in the structure a hydroxyl, carboxyl, or carbonyl group and an acid dianhydride and is soluble in organic solvents, (B) a (meth)acrylic compound having one or more carbon-carbon double bonds, and preferably (C) a photoreaction initiator and/or (D) a flame retardant. The composition exhibits various excellent properties and are particularly excellent in practicality to be favorably used for electronic components or the like. |