| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c0f8dc752059a228fada0efdcc2901b9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_adef09c2c4d312898872bd7d83513d9a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5478c667293eda5b91cb171946058826
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c7b06bc8846ccdb4ab7dc8d995312dbc |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-46 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36 |
| filingDate |
2002-10-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_59138ca6545d93247715b8c474a3c46f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_593e6668b176892543ce172d67c02697
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6b8d903183c8be45bd3243df9b10cd89 |
| publicationDate |
2003-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-03035762-A1 |
| titleOfInvention |
Curable liquid silicone composition and a semiconductor device prepared using the composition |
| abstract |
A curable liquid silicone composition is characterized by good flowability and impregnating ability, even though said composition contains an increased amount of fine silica powder added for decreasing the coefficient of thermal expansion in a cured silicone body formed by curing the composition. The fine silica powder has a ratio of isolated silanol groups to the internal silanol groups equal to or exceeding 0.01. A semiconductor device is coated with the aforementioned composition and is characterized by high reliability. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8768227-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9068049-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I568800-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103797073-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102105537-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102105537-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2013047898-A1 |
| priorityDate |
2001-10-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |