| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d40d705c93ea2d844fb62b7be7980766
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9ddc15dd46bccaee0faf2cd0627d55d2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_96cf350bc1d836a8abb07a33b0d61a1f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49155
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49147 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4092 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B3-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40 |
| filingDate |
2002-10-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5df1ebbc96f78585fe77e5b7efd4d59e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_df8e1e2975807abfc71b808942ac9cc0 |
| publicationDate |
2003-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-03035543-A1 |
| titleOfInvention |
A method of fabrication of micro-devices |
| abstract |
A method of fabricating electromechanical devices such as micro relays on printed circuit boards. The method includes the deposition of an element of the component onto an electrically conducting sacrificial layer, which is subsequently removed to form a PCB component that is suspended above the PCB substrate. In one embodiment, the vias in a multilayer PCB are used as the anchor posts for the suspended component. See stages 6.1 - 6.8 of figure 6. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11317514-B2 |
| priorityDate |
2001-10-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |