| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2eb71f61758c200b83cd797623f8fbe4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_048a72c2a1193dff62b0a27ab81a4c0a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_99505f5f312672820e9f78c254c00a4d |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3086
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0337
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3081
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76802
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0332
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31144 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-308 |
| filingDate |
2002-08-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1f9f92a7b218ceb8640e457334126adf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0b70a9178b6871f4de9b2dfcb80e1ccc |
| publicationDate |
2003-03-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-03019640-A2 |
| titleOfInvention |
Method of forming a thin layer and a contact outlet |
| abstract |
The invention relates to a method of forming a thin layer (12) comprising the following successive steps: a layer (14) is deposited on the thin layer, said deposited layer comprising a metal which is different from the material of the thin layer and which can be etched by laser; at least one opening (20) is etched in the metal layer following a pattern that coincides with at least one part of the thin layer that is to be eliminated, said metal layer being locally subjected to a laser beam for the aforementioned etching; the underlying thin layer is etched locally following the pattern and using the metal layer as an etch resist. The invention can be used to produce contact outlets. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102009057881-A1 |
| priorityDate |
2001-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |