| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bce787970b69aeb08d159e7c101c9ed7 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31053
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76229 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-762 |
| filingDate |
2002-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_26ec2b8d1d70602623e0d7d933741ca6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_123de516e4b96e2e2b90d0a0c24de42e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5794ae6d9dae4dcdf6c39914417f30bd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_587601ae6ee5f9aa34fd7542a32c171a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5ae36b077dfd45501984e139cf1ee6af
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_560d61b9f15c5318d11c3f4f7012fb44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1932ee3508e5cc5e66a8634b04ede698
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_97524fe1cb5e2b0fcc7bdfaa07570d81 |
| publicationDate |
2003-01-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-03009349-A2 |
| titleOfInvention |
Methods and compositions for chemical mechanical polishing substrates covered with at least two dielectric materials |
| abstract |
Methods and compositions are provided for planarizing a substrate surface with reduced or minimal defects in surface topography. In one aspect, a method is provided for processing a substrate including positioning a substrate comprising at least first dielectric material and second dielectric material disposed thereon in a polishing apparatus, polishing the substrate with a first polishing composition having a first selectivity, and polishing the substrate with a second polishing composition having a second selectivity greater than the first selectivity. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/GB-2405151-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7063597-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2006053096-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2006053096-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8241516-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/GB-2405151-A |
| priorityDate |
2001-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |