http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-0228940-A1

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filingDate 2001-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ea775676953cbc9547634916fe4bbad4
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publicationDate 2002-04-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-0228940-A1
titleOfInvention Polyphenol resin, process for its production, epoxy resin composition and its use
abstract The invention aims at providing an epoxy resin composition which is excellent in flexibility and capable of forming thin film and can give flame-retardant products of curing. The invention is characterized by a polyphenol compound which is prepared by condensing phenol with bischloro- methylbiphenyl (BCMB) or bismethoxymethylbiphenyl, removing unreacted phenol from the reaction mixture, and then reacting the resulting system with BCMB again and has a weight-average molecular weight of 3000 or above as determined by GPC; and use of the polyphenol compound as a curing agent for epoxy resins.
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priorityDate 2000-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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