Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_50ffb52a1aff92554296fd83b2d11b81 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a3bb95d40fcb7577cf2be8faf7ce870b http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_037be6f744c24edb7a5b0b0f6b9d756d http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ad88175d1875dd2ff78667f8a718f99d http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8e43b4ca6b41ce9f54c9a895d474c81a http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bce761afbe5ba30e6cecce581c9b7335 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31511 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G8-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-145 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G61-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G61-02 |
filingDate |
2001-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ea775676953cbc9547634916fe4bbad4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_17db522543ad72b6804ff361b35a3413 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_257aa0f05d8e332ce1eda6ebef51fe97 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_14b382673ebd53e04e4337b3a8e799fa http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8fae761252005ec19a1a68b117974d04 |
publicationDate |
2002-04-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
WO-0228940-A1 |
titleOfInvention |
Polyphenol resin, process for its production, epoxy resin composition and its use |
abstract |
The invention aims at providing an epoxy resin composition which is excellent in flexibility and capable of forming thin film and can give flame-retardant products of curing. The invention is characterized by a polyphenol compound which is prepared by condensing phenol with bischloro- methylbiphenyl (BCMB) or bismethoxymethylbiphenyl, removing unreacted phenol from the reaction mixture, and then reacting the resulting system with BCMB again and has a weight-average molecular weight of 3000 or above as determined by GPC; and use of the polyphenol compound as a curing agent for epoxy resins. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2005044307-A3 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2236172-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1844815-A1 |
priorityDate |
2000-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |