| abstract |
A semiconductor product (10) comprises a silver and gold alloy layer (11), wherein the silver and gold alloy forms an outside layer of the product (11). In some embodiments, a nickellayer (12) underlies the silver and gold alloy layer (11). In further embodiments, a copper layer (13) underlies the nickel layer (12). Moreover, the present invention pertains to a semiconductor substrate comprising a silver and gold alloy layer, wherein the silver and gold alloy forms an outside layer of the semiconductor substrate. The present invention has a particular application in having a silver and gold alloy form the outside layer of various items, including a lead frame, a board grid array, a header, a printed circuit board, a Reed switch, and a connector. |