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filingDate 2001-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_48b76ce13e284fb851521d1e110d99df
publicationDate 2002-06-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-0220683-A3
titleOfInvention In situ microencapsulated adhesive
abstract A novel adhesive formed in situ in a microcapsule and method for forming such a pressure sensitive of flowable adhesive in situ in a microcapsule is disclosed. The method for forming the novel adhesive comprises providing an aqueous mixture of wall material in water; adding a substantially water insoluble core material, free radical initiator, and a solvent for the pre-polymers to the aqueous mixture. The core material comprises a first addition polymerizable pre-polymer having a Tg of less than about 0 °C, a flash point of at least 75 °C, and a boiling point of at least 175 °C. These are typically selected from acrylate to methacrylate type materials. Optionally included is a second addition polymerizable pre-polymer for providing cross-linking or interaction between polymer chains. High shear agitation is provided to the aqueous mixture to achieve a particle size of about 0.1 to 250 microns. Stirring at a first temperature effects capsule wall formation; and heating to a second temperature polymerizes the pre-polymers of the core material for form an adhesive in situ in the formed capsules.
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