| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_70ca3ea7752cc2ae9b2687d93d702a99 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10253
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3511
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-18161
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16195
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01057
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16152
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15787
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1517
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15165
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15153
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73253
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-10 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-4334
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-055
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49822 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-10 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-433
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-055
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498 |
| filingDate |
2002-05-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4725b28e869c2be5a3a7e42bab372e97
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b70a2a17a16f71f2cfeb9295eb1a14ff |
| publicationDate |
2003-12-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-02101827-A3 |
| titleOfInvention |
High performance flipchip package that incorporates heat removal with minimal thermal mismatch |
| abstract |
The present invention provides an improved semiconductor flipchip package that includes a central cavity area on the first major side for receiving a flipchip die therein. The package substrate is substantially made from a single material that serves as the support and stiffener and provides within the cavity floor all the connecting points for flipchip interconnection to the silicon die. The integral cavity wall serves as a stiffener member of the package and provides the required mechanical stability of the whole arrangement without the need for a separate stiffener material to be adhesively attached. The cavity walls may contain extra routing metallization to create bypass capacitors to enhance electrical performance. The invention discloses optional methods to cover the silicon die to enhance thermal performance of the package. |
| priorityDate |
2001-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |