| abstract |
A process for forming printed circuit boards having integral inductor cores. According to the invention, a thin nickel layer is formed on a copper foil. The copper foil structure is then laminated to a substrate such that the nickel layer is in contact with the substrate. The copper foil is removed, leaving the nickel layer on the substrate. Using photomechanical imaging and etching techniques known in the art, NiFe is plated and patterned directly on the nickel layer, thereby forming integral inductor cores of the substrate. This process of the present invention allows for the elimination of several steps used in known processes, while also reducing etch time and minimizing waste of NiFe. |