| abstract |
A method for cleaning a surface of a substrate, characterized in that it comprises the following steps (1) and (2): step (1): a step of washing the surface of a substrate with an alkaline cleaning agent containing a complexing agent, and step (2): a step of washing the surface with a cleaning agent containing hydrofluoric acid in a content (C wt %) of 0.03 to 3 wt % with a washing time (t seconds) of 45 seconds or less, provided that C and t satisfy the relationship: 0.25 ≤ tC1.29 ≤ 5, wherein the step (2) is carried out after the step (1). The method provides a highly efficient washing of a substrate, wherein 1) the substrate can be washed in a short time, 2) both a particle contaminant and metal contaminant can be removed and 3) the occurrence of a problem associated with the washing of a substrate such as re-deposition of a contaminant or a dimensional change of a processed substrate through etching is remarkably reduced. |