| abstract |
There is provided an electroless plating method and device which can form a plated film having an improved uniformity of film thickness with an enhanced selectivity, while preventing the formation of fine pores in the plated film. The electroless plating method comprises, bringing a substrate into contact with an electroless plating solution to form a plated film on the surface of the substrate, and scrubbing the surface of the plated film formed or being formed on the surface of the substrate. |