http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-02057361-A2
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_61826b473ac8bef551d808b2cd0582d9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b621d08f712e79798226698681afc84d http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bba5fcedf37015606033c907dfe4a624 |
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
filingDate | 2002-01-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_592eb21dafe02a7e06c46b80d6e72462 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_90e173531479803a9159a3404dc7a2d4 |
publicationDate | 2002-07-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | WO-02057361-A2 |
titleOfInvention | Curing agent for epoxy resins and epoxy resin composition |
abstract | A curing agent for epoxy resins, comprising (a) 30 to 99 parts by weight of (i) a modified phenol resin, which is obtained by polycondensation of a heavy oil or pitch, a phenol and an aldehyde compound in the present of an acid catalyst, and/or of (ii) a a phenol resin having a hydrocarbon group with small polarity between phenol nuclei represented by the following general formula (I): wherein R1's may be the same or different from each other and each represent an alkyl group having 1 to 10 carbon atoms, substituted or nonsubstituted phenyl group, substituted or nonsubstituted aralkyl group or alkoxy group; Z's may be the same or different from each other and each represent a divalent hydrocarbon group having 1 to 20 carbon atoms to which a nitrogen atom, oxygen atom, phosphorus atom or sulfur atom may be bonded, at least one Z in one molecule is a divalent hydrocarbon group having 5 to 20 carbon atoms to which a nitrogen atom, oxygen atom, phosphorus atom or sulfur atom may be bonded; n is a number of 0 to 8 as an average value; and p's may be the same or different from each other and each represent an integer of 0 to 3, (b) 1 to 70 parts by weight of a thiodiphenol compound represented by the following general formula (II): wherein R1's may be the same or different from each other and each represent an alkyl group having 1 to 12 carbon atoms, substituted or nonsubstituted phenyl group, substituted or nonsubstituted aralkyl group or alkoxy group, and p's may be the same or different from each other and each represent an integer of 0 to 3, and (c) 0 to 100 parts by weight of a polyhydric phenol compound having a structure other than the components (a) and (b), and epoxy resin composition comprising them, in particular to be used for semiconductor encapsulation. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2397521-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2397521-A4 |
priorityDate | 2001-01-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 361.