| abstract |
A method and apparatus for processing a microelectronic workpiece using metrology. The apparatus can include one or more processing transport units, a metrology unit (228), and a control unit (270) coupled to the metrology unit and at least one of the processing or transport unites. The control unit can modify a process recipe or a process sequence of the processing unit based on a feed forward or a feed back signal from the metrology unit. The processing unit can include, a seed layer disposition unit, a process layer electrochemical disposition unit, a seed layer enhancement layer(232), a chemical mechanical polishing unit, and/or an annealing chamber arranged for sequential processing of a workpiece. The processing units can be controlled as an integrated system using one or more metrology units, or a separate metrology unit can provide input to the processing unit. |