http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-0196885-A1

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filingDate 2000-06-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2001-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-0196885-A1
titleOfInvention Connector apparatus
abstract A mechanically compliant connector for making reliable electrical connections to contact pads on microelectronic devices. The connector can be used for burn-in of integrated circuits at the wafer level. Additional applications include probe cards for testing integrated circuits and sockets for flip-chips. One configuration of the connector includes a probes, each of which has a tip (81) projecting above a thin elongated spring (83). The spring is supported above a substrate (89) by posts (85) such that the probe tip is free to move vertically in response to a contact force on the probe tip. Deflection of the probe tip is compliantly limited by bending and stretching of the thin spring. Mechanical compliance of the tip allows arrays of the probe to contact pads on integrated circuits where the pads are not precisely planar.
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