| abstract |
This invention relates to solvent-free moisture curable one-part hot melt polyurethane adhesive or sealant compositions which are solid at room temperature. In one embodiment, the polyurethane adhesive or sealant composition comprises in percentages by weight (a) from about 20 % to about 75 % of a urethane prepolymer; (b) from about 1 % to about 66 % of a reactive, hydroxyl containing, or a nonreactive polymer formed from ethylenically unsaturated monomers; and (c) from about 20 % to about 75 % of a thermoplastic resin. In another embodiment, the polyurethane adhesive or sealant composition comprises, in percentages by weight of the polyurethane composition (a) from about 10 % to about 90 % of a urethane prepolymer; and (b) from about 5 % to about 90 % of a thermoplastic resin which is an ethylene vinylacetate/ethylene acrylate terpolymer. |