| abstract |
The invention relates to a device and a method for packing electronic components (1) using injection moulding technology. A number of components (1) are arranged in predetermined positions on a first side (2) of a subcarrier (3), said subcarrier (3) having printed conductors with contact surfaces (6) for connecting to the contact surfaces (7) of the electronic components (1) and through contacts (8) to external contacts on a second side (10) of the subcarrier (3). The subcarrier (3) consists of a ceramic substrate (11) which in its edge areas (12) on the first side (2), has a ductile metal layer (13) arranged in a ring shape. |