http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-0145480-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_26e69ef7b7bc98bfe778e419ccd664c9 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3011 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3735 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-13 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-13 |
| filingDate | 2000-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b9145ad5531c63538948400b075bf027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1c38d5a9077689686ee5938264c36980 |
| publicationDate | 2001-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | WO-0145480-A1 |
| titleOfInvention | A method and an arrangement relating to chip carriers |
| abstract | The present invention relates to a field that includes methods and arrangements pertaining to chip carriers. The invention addresses mainly the problem of mounting microchips (3) to chip carriers (1) so as to avoid an earth fault between chip (3) and carrier (1). When mounting chips in accordance with the invention, the chip (13) is placed on a chip carrier (1) that includes an electrically and thermally conductive element (13), said element including a surface (17) and a recess (15) arranged relative to said surface. The microwave chip (3) is arranged at the surface (17) of the electrically and thermally conductive element (13) by means of a fixing or bonding substance (19), which is disposed at least partially in the recess (15). When mounting the chip, the chip (3) is positioned so that an earth plane (3d) of the microwave chip (3) will lie level with the surface (17) of the electrically and thermally conductive element (13). The invention also includes a chip carrier (3) which is suitable for the aforesaid chip mounting process and which can be produced both readily and inexpensively. |
| priorityDate | 1999-12-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 32.