| abstract |
A lead-free solder alloy, characterized in that it has a chemical composition: Ag: 2 to 3 wt %, Cu: 0.3 to 1.5 wt %, Bi: 0.05 to 1.5 wt %, Sb: 0.2 to 1.5, balance: Sn and inevitable impurities, with the proviso that the total content of Ag, Cu, Sb and Bi is 5 wt % or less, and is capable of forming a smooth surface after reflow treatment; and an electronic member, such as a semiconductor device, manufactured by the use of the lead-free solder alloy. The solder alloy has an appropriate melting point and excellent resistance to thermal fatigue, and can form, after solder reflow, a surface having smoothness and excellent properties being sufficient to permit the optical evaluation for the formation of a bump, and thus can be used as an excellent material for solder bumps of an electronic member. |