| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d3082cd39bb800686b9abbb8aa05c80b |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31053
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-302 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B57-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02 |
| filingDate |
2000-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_63cd46a9c73924c833787276105029d3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_434e7c820ce49cbdaafcf5d8022a7d74
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f94619f7d74911b3e07f0e6dcdfb4f1a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_29660ad31bad0e22fade7f148a73bc26 |
| publicationDate |
2001-05-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-0132793-A2 |
| titleOfInvention |
Use of cesium hydroxide in a dielectric cmp slurry |
| abstract |
Chemical mechanical polishing compositions including an abrasive and cesium hydroxide and methods for polishing dielectric layers associated with integrated circuits using cesium hydroxide containing polishing compositions. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2006049912-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2006049912-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102337080-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9039914-B2 |
| priorityDate |
1999-11-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |