http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-0118144-A1

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filingDate 2000-09-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ec20bf57b62fdd14ef6f8d3a6fbe8114
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publicationDate 2001-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-0118144-A1
titleOfInvention Photocurable pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet
abstract A photocurable pressure-sensitive adhesive composition which has pressure-sensitive adhesive properties at ordinary temperature, cures upon exposure to light to give a cured film having sufficient bonding strength especially when applied to adherends having high polarity. The composition comprises a polyester resin having a glass transition temperature (Tg) in the range of -60 to 25°C, a cationically photopolymerizable compound, and a cationic photopolymerization initiator.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-100349908-C
priorityDate 1999-09-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 28.