http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-0117324-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_452f59e1f2ff55012ae56c1d47439929 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09063 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0052 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0097 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0909 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-361 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09409 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-144 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-148 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-117 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11 |
| filingDate | 1999-09-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b9169de212e855f91333746d75a446f3 |
| publicationDate | 2001-03-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | WO-0117324-A1 |
| titleOfInvention | Bottom or top jumpered foldable electronic assembly, and method for manufacture |
| abstract | An electronic assembly is made up of a number of rigid circuit boards manufactured on the same or different substrates or panels and with the same materials separated from each other electrically and physically. One of the rigid circuit boards has a comb (7) of printed tabs, or fingers, at the edge, which connects the assembly physically and electrically to a motherboard. Flexible wire jumpers (5) bridge the comb to form electrical connections between the boards. Both boards have printed circuit tabs placed in alignment to each other on both boards across a gap (21) which separates both boards. These tabs facilitate electronic interconnection of both boards via the flexible jumpers, which are groups or clusters of wires (4) separated from each other via a flexible insulator. A method for manufacturing the assembly is also disclosed, in which two boards (1, 2) are created by cutting gaps (21) from a substrate, leaving the two boards separated by a gap and connected by snap-offs (6). Once all the intended electronic components (9) and the flexible jumpers are soldered onto the boards, the boards are rotated, snapping them apart. After a desirable spacing between components of both boards is achieved, both boards are pinned together to maintain achieved proximity. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108848612-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108848612-A |
| priorityDate | 1997-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID15008962 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID414329572 |
Total number of triples: 26.