| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c3a24d25076e91ea7cfe1827cb1045cf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6b94243e182eec8d185d029fcb0817f8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_94b59679f6977a0882adb7bde9b9871c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5d0421204720dd98243acd1ae1f60229
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_85e70c4bdc536f310b385c863cce1165
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2f7594416e6a55e3f373ad6a1e08d6f3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f1858f84940bd86ca6fa7aeca02406f0 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1427
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02 |
| filingDate |
2000-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_16e4b843f2d932787ae912db28ca97a2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_394acd956a48020376321dad1f7fe7d1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3d688de1e87e4f82b3036b7392ffc4dc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_47765eaf1d23f6d865a167f5b5580b02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e3ce7edf0b0c01f8d2e7dca8ad740425 |
| publicationDate |
2002-07-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-0073396-A9 |
| titleOfInvention |
Slurry composition and method of chemical mechanical polishing using same |
| abstract |
The present invention provides a slurry composition for chemical mechanical polishing comprising spinel particles having the formula: AO•xZ2O3 wherein A is at least one divalent cation, Z is at least one trivalent cation, and 0.01 ≤ x ≤ 100. The present invention also includes a method of chemical mechanical polishing the surface of a substrate using slurry compositions that include these spinel particles. The slurry compositions of the present invention provide the desired level of planarization and selectivity for both metal and oxide surfaces. In addition, the slurry compositions of the invention can be prepared such that they are substantially free of alpha phase alumina particles and other high hardness particles to produce a scratch-free polished surface. |
| priorityDate |
1999-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |