| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4221cd33062e36921bcef108c3c01459
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bd7ed215807b95cccfce4fa200817adb |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K8-5086
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-5419 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K8-508
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-5419 |
| filingDate |
2000-05-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_97e4ffdbfc768af8da914ae96e9bc2f9 |
| publicationDate |
2000-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-0073376-A1 |
| titleOfInvention |
Organosilicon composition |
| abstract |
The present invention relates to use of an inhibitor compound in an organosilicon composition for inhibiting curing of the organosilicon composition by a hydrosilylation reaction at a temperature of 40 °C to 100 °C, or 100 °C and above, and a pressure of 1 x 106 n/m2 to 5 x 106 N/m2, or 5 x 106 N/m2 and above. In a preferred application the organosilicon composition cures to form a silicone gel or elastomeric seal or plug within an oil or gas well. Preferred inhibitor compounds are 1-ethynyl-1-cyclopentanol and 1-ethynyl-1-cyclohexanol. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9631459-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10287849-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10006265-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10087697-B2 |
| priorityDate |
1999-05-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |