http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-0070680-A1
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_343ab6df82aaaa413d03e51a1c42c4d2 |
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3011 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53219 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76838 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-532 |
filingDate | 1999-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_674ba6d35923cd115902ec1d1d77fec7 |
publicationDate | 2000-11-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | WO-0070680-A1 |
titleOfInvention | Methods and compositions for improving interconnect metallization performance in integrated circuits |
abstract | A semiconductor device includes a plurality of interconnect metallization lines, each interconnect metallization line (38) being provided with an electromigration-impeding composition including a percentage by weight of aluminum, a percentage by weight of copper, and a percentage by weight of zinc. The electromigration-impeding composition of the lines may include a structure of a solid solution of Al and Zn in the form of grains (36). The grains are bounded by grain boundaries (37). The structure further includes a precipitate of Al and Cu defined in the grain boundaries. Electromigration of the Al from the grain boundaries occurs and tends to cause the Al to electromigrate from the grains. The percentage by weight of Zn is selected to both define the solid solution with Al and to impede the electromigration of the Al from the grains. |
priorityDate | 1999-05-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 26.