| abstract |
A resin composition comprising a blend of a crystalline polyimide, e.g., one represented by formula (1) wherein R1 represents an optionally substituent, divalent, C2-30, aromatic or aliphatic, organic group; and Ar1 represents an optionally substituted, C6-45 aromatic group, with a thermoplastic polyester. The resin composition is excellent in mechanical properties, e.g., high modulus, and in flowability and heat resistance. It is suitable for use in electronic parts capable of surface mounting. |