| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_111052aebe489f2feb4b4a0967114a27
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f9e9d6645d53932adf6c21497264d474
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a820dfd41a9b2b625ebf9159d29d2c90 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0112
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0315
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-385
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49155
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49165
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0323
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49126 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4652
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0038 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate |
2000-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_78dc93f06c63be8a727599c704d325d7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a64d2ae31b7d6893c98b7524e85ae800 |
| publicationDate |
2000-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-0057680-A1 |
| titleOfInvention |
Method for manufacturing a multilayer printed circuit board and composite foil for use therein |
| abstract |
A method for manufacturing a multilayer printed circuit board is disclosed. First a composite foil (10) including a functional copper foil (16) mounted on a carrier foil (12) is laminated on a core board (20). The functional copper foil (16) is less than 10 νm thick, and has a front side facing the carrier foil (12) and a back side coated with a resin (18). Next, the carrier foil (12) is removed from the functional copper foil (16), in order to uncover the front side of the functional copper foil (16). Then, a CO2 laser source is used to drill holes through the functional copper foil (16) and the resin (18) in order to form microvias (24). It is also disclosed a composite foil (10) comprising four different layers for use in the manufacture of a multilayer printed circuit board. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8895152-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100821017-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11523519-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6863936-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/SG-98017-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-03008671-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-1871047-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8914974-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1289354-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/LU-90804-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1432292-A4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1432292-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10194537-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2010048653-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7049007-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9026885-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1525900-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2005039692-A1 |
| priorityDate |
1999-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |