| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_90d88de4b385f76fe506e6f0cc935738
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8fb9f44db08d1c42a53f3d28eaae416f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5b52475e92624eaba0eb1c4bbc7a544d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G63-676 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L67-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L67-07
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F283-01 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G63-676 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L67-07
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F283-01
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L67-06 |
| filingDate |
2000-03-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_495e99531d7193e33f1d050621ae52f0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dde1613527ceea7ff90922bea31372bf |
| publicationDate |
2000-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-0055247-A1 |
| titleOfInvention |
Water-based resin composition |
| abstract |
A thermosetting water-based resin composition comprising an oil-soluble initiator of which a temperature for one-minute half-life is from 90° to 270 °C and a polycondensation resin comprising an unsaturated dicarboxylic acid having a radical-polymerizable unsaturated bond or an acid anhydride thereof as at least one constituent monomer, wherein the polycondensation resin has an acid value of from 3 to 100 mg KOH/g, and wherein said oil-soluble initiator is present in said polycondensation resin; a process for preparing the thermosetting water-based resin composition; a molding compound composition comprising the water-based resin composition; and a molding product prepared by molding the molding compound composition. |
| priorityDate |
1999-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |