| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d15fa0ab02fe831ee437883fe35b086d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49163
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10287
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10416
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24157
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49165
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T156-1056
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-52 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4046
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-382
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-389
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49883 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40 |
| filingDate |
1999-11-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f98c17f204e1263c90bb0e7a5941c318
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_49dc7348df3647bf811390dddd007afe |
| publicationDate |
2000-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-0026942-A3 |
| titleOfInvention |
Method for producing filled vias in electronic components |
| abstract |
The present invention relates to a process for producing filled vias (230) which are made of two components, a first component (240) which forms a bonding layer between the wall of the via and a second component (250) which forms the core of the via. Preferably, the two components solidify from a melt which includes two immiscible liquids. The first liquid is capable of wetting the wall of the via and the second liquid. The resulting product is also disclosed. Preferably the first component comprises a copper oxide and the second component comprises a conductive metal such as silver or copper. |
| priorityDate |
1998-11-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |