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filingDate 2016-02-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2020-02-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_98962d7a569b930bf84eb5a1096c2e97
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publicationDate 2020-02-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-RE47866-E
titleOfInvention Three-dimensionally stacked nonvolatile semiconductor memory
abstract A three-dimensionally stacked nonvolatile semiconductor memory of an aspect of the present invention including conductive layers stacked on a semiconductor substrate in such a manner as to be insulated from one another, a bit line which is disposed on the stacked conductive layers, a semiconductor column which extends through the stacked conductive layers, word lines for which the stacked conductive layers except for the uppermost and lowermost conductive layers are used and which have a plate-like planar shape, memory cells provided at intersections of the word lines and the semiconductor column, a register circuit which has information to supply a potential suitable for each of the word lines, and a potential control circuit which reads the information retained in the register circuit in accordance with an input address signal of a word line and which supplies a potential suitable for the word line corresponding to the address signal.
priorityDate 2008-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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