Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8553733a3c1342775263026d3e90631c |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-0207 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-0823 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-7371 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-66242 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5221 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-42304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-73 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-762 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-0692 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-564 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-737 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-082 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-02 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-737 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-73 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-423 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-66 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-762 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-522 |
filingDate |
2016-03-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2018-06-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_322765cf05e73757de93b69ed2cc3c33 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7dc80f8c1dc9889c4bfc17c71c2a44d5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bef6167bf20354f356b6b25c28e0189b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b04a40fb27051d6838d25cc889f71b50 |
publicationDate |
2018-06-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-9991198-B2 |
titleOfInvention |
Layout method for compound semiconductor integrated circuits |
abstract |
A layout method for compound semiconductor integrated circuits, comprising following steps of: forming a first metal layer within a first circuit layout area which intersects with a second circuit layout area at an intersection area on a compound semiconductor substrate; defining an adjacent crossover area including said intersection area and a peripheral adjacent area thereof; a first dielectric area located within said adjacent crossover area and intersected with at least part of said intersection area; forming a first dielectric block within said first dielectric area or forming said first dielectric block within said first dielectric area and a second dielectric block outside said first dielectric area, the thickness of said second dielectric block is no greater than and the thickness of at least part of said second dielectric block is smaller than the thickness of said first dielectric block; forming a second metal layer within said second circuit layout area. |
priorityDate |
2015-10-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |