| abstract |
An object of the present invention is to provide a photosensitive resin composition for projection exposure capable of forming a resist pattern that is excellent in adhesion, resolution, and inhibitory properties against the occurrence of resist footing, and the present invention provides a photosensitive resin composition for projection exposure comprising (A) a binder polymer; (B) a photopolymerizable compound having an ethylenically unsaturated bond; (C) a photopolymerization initiator; and (D) a sensitizing dye, wherein the (B) photopolymerizable compound having an ethylenically unsaturated bond comprises a (meth)acrylate compound having a skeleton derived from dipentaerythritol and a compound represented by the following formula (III): n n n n n n n n n n n n wherein R 8 , R 9 , R 10 , and R 11 each independently represent a hydrogen atom or a methyl group, X and Y each independently represent an ethylene group or a propylene group, p 1 , p 2 , q 1 , and q 2 each independently represent a numerical value of 0 to 9, both p 1 +q 1 and p 2 +q 2 are 1 or more, and p 1 +q 1 +p 2 +q 2 is 2 to 9. |