Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0ddb9f3656270bc5410be3679322fead |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L51-04 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-1477 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-063 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L51-04 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L51-04 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-00 |
filingDate |
2014-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2018-05-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4a276d96435f86179816c67e723b1603 |
publicationDate |
2018-05-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-9976027-B2 |
titleOfInvention |
Polymer fine particle-containing curable resin composition having improved storage stability |
abstract |
A curable resin composition of the present invention contains 1 to 100 parts by mass of a polymer fine particle (B) relative to 100 parts by mass of an epoxy resin (A), wherein the polymer fine particle has a core-shell structure, the core layer of the polymer fine particle is diene rubber, the content of the epoxy group of the polymer fine particle (B) is 0.01 to 0.2 mmol/g. A curable resin composition (I) of the first embodiment contains 0.5 to 30 parts by mass of fumed silica as an inorganic filler (C). In addition, a curable resin composition (II) of the second embodiment contains bisphenol A epoxy resin and rubber-modified epoxy resin and/or urethane-modified epoxy resin as the epoxy resin (A). |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11624012-B2 |
priorityDate |
2013-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |