| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6af9a57049d2d91c036d4f5ab49154cb |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5226 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76843
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76855
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76846
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5283
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5226
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76895
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53266
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53295
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76883
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76802
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76804 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-528
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-522
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-532
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate |
2017-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2018-04-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1e12a5d6ca237d64ab27c2711f3c6ca5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ef8325a06e5a9fe893533f96482cf53d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7d0d4593599d09d89b49e74b9f4367af
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_62b81c8ce15f16f24672c0340216ffa6 |
| publicationDate |
2018-04-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-9953927-B1 |
| titleOfInvention |
Liner replacements for interconnect openings |
| abstract |
Structures for a liner replacement in an interconnect structure and methods for forming a liner replacement in an interconnect structure. A metallization level is formed that includes a conductive feature. A dielectric layer is formed on the metallization level. The dielectric layer includes an opening that extends vertically through the dielectric layer to the conductive feature. An adhesion layer is formed on area of the conductive feature exposed at a base of the opening. The adhesion layer has a thickness equal to a monolayer or a fraction of a monolayer. Another layer (e.g., barrier layer) of a different composition (e.g., TiN) may be deposited on the adhesion layer before the opening is filled with metal deposited by chemical vapor deposition. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11183424-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10741442-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11043413-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2019371660-A1 |
| priorityDate |
2017-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |