| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5d7576285d411d00c697e07270d2814a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24917 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-185
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1651
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1639
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1886
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1844
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-54 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B05D3-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 |
| filingDate |
2014-02-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2018-04-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5d5e991d3a174971e3695d725c605c06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f18e14c1c225c0cc5359968fd902be28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1dde3b6866def77defe47d4c362de250
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4eb0ddb059feccac8385b3c62b774d19 |
| publicationDate |
2018-04-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-9949374-B2 |
| titleOfInvention |
Electroless plating method and ceramic substrate |
| abstract |
Provided is an electroless plating method for a low temperature co-fired glass ceramic substrate, the method including: a degreasing and activation treatment step of degreasing and activating a surface of a wiring pattern formed of a silver sintered body; a catalyzing step of providing a catalyst onto the surface of the wiring pattern formed of a silver sintered body; and an electroless multi-layered coating plating treatment step. The electroless plating method further includes, between the degreasing and activation treatment step and the catalyzing step, a silver precipitation treatment step of precipitating silver on a glass component present on the surface of the wiring pattern formed of a silver sintered body after the degreasing and activation treatment step, and the catalyzing step includes providing the catalyst also to the silver precipitated in the silver precipitation treatment step. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11674228-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2022186378-A1 |
| priorityDate |
2013-02-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |