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filingDate 2016-06-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2018-04-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2018-04-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-9941450-B2
titleOfInvention Roll-to-roll fabricated light sheet and encapsulated semiconductor device
abstract A bottom electrically conductive surface is disposed on the top surface of a substrate and a top electrically conductive surface disposed on the bottom surface of a superstrate. A bare die electronic device is disposed with at least one of its top conductor in direct electrical communication with the bottom electrically conductive surface and/or its bottom conductor in direct electrical communication with the top conductive surface. A non-conductive adhesive secures the substrate to the superstrate so that the bare die electronic device is retained in direct electrical communication. The non-conductive adhesive has a melting point temperature at least greater than a minimum operating temperature of the operating temperature range of the bare die, so that the non-conductive adhesive does not melt and flow thereby preventing a separation or degradation of the direct electrical connection of the bare die electronic device.
priorityDate 2015-06-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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