http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9934995-B2

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filingDate 2014-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2018-04-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2018-04-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-9934995-B2
titleOfInvention Method for manufacturing a handle substrate for the temporary bonding of a substrate
abstract This process includes steps: a) providing a carrier substrate including a receiving face; b) depositing a nonstick coating on the receiving face, the nonstick coating including a central region and a peripheral region; and c) trimming the carrier substrate so as to remove the peripheral region of the nonstick coating and to form a recess on the periphery of the carrier substrate, in order to obtain the handle wafer. Also relates to a process for temporarily bonding a substrate to a handle wafer fabricated using the process described above. Furthermore relates to a handle wafer fabricated using the process described above.
priorityDate 2013-12-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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