http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9907184-B2
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_cee5533cf5398a3415ad496539cca2bc |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49146 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0278 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-086 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0195 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1105 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H02M1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-284 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01F27-022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01F41-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01F41-005 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01F27-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H02M1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
| filingDate | 2015-09-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2018-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2263507832df8c15bdff1c3870f4dddb http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f5bd989f8dd0376dbaaa71c4a4007337 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_501cf1f6c437c78683ddb6275c599d5d |
| publicationDate | 2018-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | US-9907184-B2 |
| titleOfInvention | Manufacturing method for a power supply module |
| abstract | A power supply module and its manufacturing method are disclosed. The manufacturing method for the power supply module includes: configuring a coil such that coil terminals are configured by way of electrical connection in the preset circuit connection configuration of the connector; preparing a mold cavity, and placing the connector housed with the coil and the electronic components into the mold cavity; making a magnetic mixture, and filling the mold cavity where the connector is placed with the magnetic mixture to form a magnetic body under pressure, wherein the magnetic body encapsulates at least the coil, the electronic components and a portion of the connector adapted to house the coil and the electronic components, and the terminal is exposed outside the magnetic body; demolding the magnetic body from the mold cavity; and increasing the temperature of the demolded magnetic body by heating. In this way, the molding pressure for forming the power supply module is lower and the manufactured power supply module has good performance of heat transfer. |
| priorityDate | 2014-09-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 36.