Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_aea8583efc4aa4e2a9706d789804d37b |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76816 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5226 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31116 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76804 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-522 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-311 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
filingDate |
2014-07-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2018-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6b09cc900928844470b4cd9389a6ab7b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8d9f2036bf7f638f7005e37781bec826 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ce898bea620817352a78d4b08db7487e |
publicationDate |
2018-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-9905509-B2 |
titleOfInvention |
Inverted-T shaped via for reducing adverse stress-migration effects |
abstract |
A semiconductor interconnect structure is formed as a via with an inverted-T shape to increase the reliability of the interface between the interconnect structure and an underlying electrically conductive, e.g., copper (Cu), layer of material. The inverted-T shape effectively increases a bottom critical dimension of the via, thereby reducing and/or eliminating via degradation of the interconnect structure caused by voids in the electrically conductive layer introduced during high-temperature or stress-migration baking. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2021111119-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20200030938-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11476215-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11011485-B2 |
priorityDate |
2014-07-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |