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filingDate 2014-07-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2018-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2018-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-9905509-B2
titleOfInvention Inverted-T shaped via for reducing adverse stress-migration effects
abstract A semiconductor interconnect structure is formed as a via with an inverted-T shape to increase the reliability of the interface between the interconnect structure and an underlying electrically conductive, e.g., copper (Cu), layer of material. The inverted-T shape effectively increases a bottom critical dimension of the via, thereby reducing and/or eliminating via degradation of the interconnect structure caused by voids in the electrically conductive layer introduced during high-temperature or stress-migration baking.
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