| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_10b66481c62e6c23863d211449448912
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_008d89f84b614c39d4b797876b164ffa
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d63a0403f7bdaf2ca8b93d936dd12a17
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_24d7d9a550f271fa41439e11bb288ffe |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24975
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-25
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-2848
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-302 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-088
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-641 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B5-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-64
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-088
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-20 |
| filingDate |
2012-04-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2018-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fb31a3b9efda2783dc345b44b88167f4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e209438be96b369ad2860262753f8f83
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_21954e745feec2f567dc6c9bc4f9c827 |
| publicationDate |
2018-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-9902137-B2 |
| titleOfInvention |
Thin metal substrate having high thermal conductivity |
| abstract |
A thin metal substrate having high thermal conductivity includes a copper foil layer, an insulating polymer layer and a thermal conductive adhesive layer. The thermal conductive adhesive layer has a resin and a thermal conductive powder dispersed in the resin. The insulating polymer layer is disposed between the copper foil layer and the thermal conductive adhesive layer. Since the thermal conductive adhesive layer has the thermal conductive powder and the insulating polymer layer has insulating and anti-breakdown abilities, the substrate has a reduced thickness, high heat dissipating efficiency and improved insulating performance. |
| priorityDate |
2011-01-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |