| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_053d08ecab1a8e6b3fcf4f28030a4e23 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09509
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-072
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-423
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-429 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4084
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4661
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-115
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0313
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-034
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4611
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-381 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| filingDate |
2015-05-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2018-02-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3e507a35d4d67517fd0b4e9d76405186
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9490bc7fa2538be44a7c65fa6b5bbecf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_491ad933b2bcea6f9b2ecf59d3747634 |
| publicationDate |
2018-02-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-9894765-B2 |
| titleOfInvention |
Printed wiring board and method for producing printed wiring board |
| abstract |
An object of the present invention is to provide a printed wiring board in which conductive layers formed on two surfaces of a base layer that contains a fluororesin as a main component are reliably connected to each other through a via-hole. A printed wiring board according to an embodiment of the present invention includes a base layer containing a fluororesin as a main component, a first conductive layer stacked on one surface of the base layer, a second conductive layer stacked on the other surface of the base layer, and a via-hole that is formed along a connection hole penetrating the base layer and at least one of the first conductive layer and the second conductive layer in a thickness direction and that electrically connects the first conductive layer and the second conductive layer to each other. At least a part of an inner circumferential surface of the base layer in the connection hole has a pre-treated surface having a content ratio of oxygen atoms or nitrogen atoms of 0.2 atomic percent or more. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10104771-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11294285-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2020084895-A1 |
| priorityDate |
2014-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |