| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a3d52eacd83e723ebd2ca61b598586c2 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N2021-887 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N21-8806
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N21-9501 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N21-88 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N21-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N21-95 |
| filingDate |
2013-05-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2018-01-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e4fbd870363d3c11f4c1b73f1265efaf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bdae5a0b2b1a6b01b301cf667fa3394d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6aa4c3947b48cae07058bc4eadb76baf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e7b162a3eb59b440286ea11658658404
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7add21927a074b73d34a91ab18339d52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_be9e8d3e88703b35f5f4449d1d87ba86
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_30d2a5c992786857e9e224ba4841dea4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_640d9610a3c5d982e16512c6e95ca770 |
| publicationDate |
2018-01-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-9880107-B2 |
| titleOfInvention |
Systems and methods for detecting defects on a wafer |
| abstract |
Systems and methods for detecting defects on a wafer are provided. One method includes generating output for a wafer by scanning the wafer with an inspection system using first and second optical states of the inspection system. The first and second optical states are defined by different values for at least one optical parameter of the inspection system. The method also includes generating first image data for the wafer using the output generated using the first optical state and second image data for the wafer using the output generated using the second optical state. In addition, the method includes combining the first image data and the second image data corresponding to substantially the same locations on the wafer thereby creating additional image data for the wafer. The method further includes detecting defects on the wafer using the additional image data. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11255748-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020150271-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10902582-B2 |
| priorityDate |
2009-01-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |