| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_51d028c578ae85cb937b5b34a5129fbc |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49822
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49816
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15156
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0401
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-1058
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-1023
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81192
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06517
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15153
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-97
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-1088
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05147 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0657
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49816
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49822
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49838
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-17
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-105 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498 |
| filingDate |
2015-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2018-01-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_80bf294ef00dc02549dfc5e19a24d21b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6033e46da3fe4a410447e26948661c30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f9c4079436bd9f95cd9b0a52f563c2e0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bf973ae675658bbc956da7d68c8fd75c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c6288718c30ea9f1e652d3ef13a08016
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_97d033f17d52bc47853210bb485ea200 |
| publicationDate |
2018-01-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-9865568-B2 |
| titleOfInvention |
Integrated circuit structures with recessed conductive contacts for package on package |
| abstract |
Disclosed herein are integrated circuit (IC) structures having recessed conductive contacts for package on package (PoP). For example, an IC structure may include: an IC package having a first resist surface; a recess disposed in the first resist surface, wherein a bottom of the recess includes a second resist surface; a first plurality of conductive contacts located at the first resist surface; and a second plurality of conductive contacts located at the second resist surface. Other embodiments may be disclosed and/or claimed. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2018226381-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10424561-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017170109-A1 |
| priorityDate |
2015-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |