| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f3ac14887414890771574e163164e665 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01P2004-64
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01P2004-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01B33-18 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G11B5-8404
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01B33-146
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1409
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-044
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01B33-14 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C01B33-18 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C01B33-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C01B33-146
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G11B5-84 |
| filingDate |
2016-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2018-01-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e6158787941e41abbe88eb5dbfdb6b09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_50b9352646e64a0ebe4b644f9c728d82 |
| publicationDate |
2018-01-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-9862863-B2 |
| titleOfInvention |
Polishing composition and method for polishing magnetic disk substrate |
| abstract |
Embodiments of the invention provide a polishing composition including colloidal silica having an average particle size of 5 to 200 nm and pulverized wet-process silica particles having an average particle size of 0.1 to 1.0 μm, wherein a value of the ratio of the average particle size of the wet-process silica particles to that of the colloidal silica is from 2.0 to 30.0. The polishing composition, according to various embodiments, achieves a high polishing rate and has a good surface smoothness, without the use of alumina particles. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10822525-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2018215953-A1 |
| priorityDate |
2014-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |